GEIA HB 0005 2 PDF

GEIA HB 0005 2 PDF

Buy GEIA HB (R) Technical Guidelines For Aerospace And High Performance Electronic Systems Containing Lead-Free Solder And Finishes. Find the most up-to-date version of GEIA-STD at Engineering TechAmerica GEIA-HB Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-Free Solder.

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This Standard establishes processes for documenting the mitigating steps taken to reduce the harmful effects of tin finishes in electronic systems. Using the 0050 of two sword-fencers for illustration, Wickham explained different failure modes: Level 3 managed whisker risks through complete avoidance.

Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

There had been a move away from component termination material type, structure and processing as specific mitigation strategies. You may delete a document from your Alert Profile at any time. Therefore, the use of adequate reflow soldering processes is critical for producing solder joints that are acceptable for their end-product use environment.

Charles Cawthorne then introduced Dr Mark Ashworth of Loughborough University, who discussed the effect of plating methodologies, the first of two presentations describing research carried out at Loughborough into jb and strategies for tin whisker mitigation. Please first verify your email before subscribing to alerts.

The body configuration of SMT electrolytic capacitors results in the solder joints being only partially visible for optical inspection purposes. The factors influencing whisker growth were 00005 bath chemistry, whether pure tin or a tin alloy, bright or matte, electroplating parameters such as current density, temperature and agitation, and substrate, taking copper, brass and alloy 42 as examples.

Summarizing at a high level, these challenges represent risks associated with 1 durability of the interconnection and 2 deleterious effects of tin whiskers.

Dr Dunn had collected data on whiskering effects over a period of 32 years, using the C-Ring test to introduce tensile and compressive stress, with different metal substrates, barrier layers and tin plating thicknesses, and the results were shortly to be published. Upon reviewing these plans, several research consortiums and organizations embraced the plan and, to date, have addressed many of the technical needs although the significant effort of obtaining sufficient data to develop Pbfree reliability models still remains unanswered [15].


Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1

Plated brass, tin-plated brass with a copper barrier beia, tin plated steel, tin-plated steel with a copper barrier layer, all displayed their own characteristics, sometimes predictable, sometimes not, but fused tin plating showed no whisker nucleation on any of these substrates during the 32 years of the study.

With a heavy dependence on COTS to maintain a competitive edge, the industry is heavily influenced by the commercial supply chain geix its increasing use of Pb-free materials. The plan included a list of tasks necessary to provide ADHP engineers sufficient information to minimize risks associated with Pb-free solders and finishes.

Subscription pricing is determined by: In summary, as the standards had evolved, they had become increasingly definitive with regard to component-to-component spacing design rules. Engineers will need to “act like engineers” in order to comprehend this information and apply it to their needs.

This standard is not included in any packages. A Circuitnet Media Publication. Cawthorne reviewed the definitions of the mitigation control levels defined in GEIA-STD, commenting that the required level would normally be a function of the design authority in consultation with the customer, and that military applications would typically expect mitigation to at least Level 2B—risks managed primarily through mitigations, including design rules, and more likely 2C—risks managed more by avoidance and less by mitigation.

Pulse plating could be used as a means of manipulating the grain structure and orientation of the tin deposit, and in some instances showed reduced whisker growth compared with direct current deposits.

But, because of RoHS legislation, increasing numbers of components were only available with pure tin finishes. He began his presentation on problems associated with whisker growths with a remarkable time-lapse video recorded by researchers at Brown University, showing the initiation and growth of a tin whisker at a steady rate of about 1 micron per hour over a period of 40 hours.


Standards Subscriptions from ANSI provides a money-saving, multi-user solution for accessing standards. The deposit characteristics studied were thickness, grain size, morphology, orientation, intermetallic formation and elemental diffusion effects, under varying conditions of temperature, humidity, thermal cycling and applied external stress. Remoteness and the inability to repair systems in situ obviously made the reliability issue even more critical, albeit for example Voyager 1 was still functioning after 39 years in operation.

This standard is applicable to Aerospace and High Performance electronic applications which procure equipment that may contain Pb-free tin finishes.

Trends for Printing Ultra Miniature Chips. A distinguished group of experts gathered at Loughborough University in the East Midlands of the UK to share their knowledge with a room-full of engineers from the defence, aerospace and high-reliability electronics sector, at a seminar organised by SMART Group.

Although higher currents would cause instant burn-out, in high-vacuum conditions a short circuit could result in a plasma discharge. Each batch of eight boards was delivered to consortium partners for coating and returned to NPL for testing. If the document is revised or amended, you will be notified by email.

While considerable progress has been made in closing Pb-free knowledge gaps, the challenge of characterizing performance and reliability still needs to be addressed. Martin Wickham reviewed previous findings and gave an update on current work.

Standards Subsctiption may be the perfect solution. Since the introduction of the RoHS legislation inthe threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. Other resources include work performed in to benchmark the Pb-free technical knowledge base as well as develop a roadmap and plan to close those technical data gaps [13, 14].